ATmega328P-PU Microchip Technology IC MCU 8BIT 32KB FLASH 28DIP

label:
2023/10/26 189



• High Performance, Low Power AVR® 8-Bit Microcontroller Family
• Advanced RISC Architecture
• High Endurance Non-volatile Memory Segments
• QTouch® library support
• Peripheral Features
• Special Microcontroller Features
• I/O and Packages
• Operating Voltage: 1.8 - 5.5V


CATALOG
ATmega328P-PU COUNTRY OF ORIGIN
ATmega328P-PU PARAMETRIC INFO
ATmega328P-PU PACKAGE INFO
ATmega328P-PU MANUFACTURING INFO
ATmega328P-PU PACKAGING INFO
ATmega328P-PU ECAD MODELS


COUNTRY OF ORIGIN
Taiwan (Province of China)
Thailand


PARAMETRIC INFO
Data Bus Width (bit) 8
Family Name ATmega
Device Core AVR
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 20
Program Memory Type Flash
Program Memory Size 32KB
RAM Size 2KB
EEPROM 1KB
Direct Memory Access No
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Input Capture Channels 1
Output Compare Channels 2
Internal/External Clock Type Internal/External
Touch Sensing Interface No
Power On Reset No
Memory Protection Unit No
Temperature Sensor Yes
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Maximum CPU Frequency (MHz) 20
Number of Programmable I/Os 23
Number of Timers 3
ADC Channels 8
ADC Resolution (bit) 10
Core Architecture AVR
Number of ADCs Single
PWM 6
Watchdog 1
Analog Comparators 1
Parallel Master Port No
Real Time Clock No
Timers Resolution (bit) 16
Interface Type SPI/TWI/USART
Programmability Yes
SPI 2
I2C 0
Process Technology CMOS
I2S 0
UART 0
USART 1
CAN 0
USB 0
Ethernet 0
Minimum Operating Supply Voltage (V) 1.8
Typical Operating Supply Voltage (V) 2.5|3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 2.5|3.3|5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package PDIP W
Basic Package Type Through Hole
Pin Count 28
Lead Shape Through Hole
PCB 28
Tab N/R
Pin Pitch (mm) 2.79(Max)
Package Length (mm) 37.4(Max)
Package Width (mm) 6.76(Max)
Package Height (mm) 3.28(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 5.06(Max)
Mounting Through Hole
Package Material Plastic
Package Description Plastic Dual In Line Package
Package Family Name DIP
Jedec N/A


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 245
Reflow Solder Time (Sec) N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) N/A
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 14


ECAD MODELS


Produkts RFQ