SPC5643LFF2MMM1 NXP Semiconductors IC MCU 32BIT 1MB FLASH 257MAPBGA

2026/09/23 74

CATALOG

Malaysia

China

United States of America

Family Name	MPC56xx
Data Bus Width (bit)	32
Device Core	e200z4
Instruction Set Architecture	RISC
Maximum Clock Frequency (MHz)	120
Program Memory Type	Flash
Program Memory Size	1MB
RAM Size	128KB
Maximum CPU Frequency (MHz)	120
GPIO	16
Number of Timers	5
ADC Channels	16/16
ADC Resolution (bit)	12/12
Number of ADCs	2
Core Architecture	e200
PWM	2
Number of Watchdog Timers	1
Special Features	CAN Controller
Interface Type	CAN/SCI/SPI/UART
Programmability	Yes
SPI	3
I2C	0
I2S	0
UART	2
USART	0
CAN	2
USB	0
Ethernet	0
Maximum Power Dissipation (mW)	1500
Minimum Operating Supply Voltage (V)	3\|4.5
Typical Operating Supply Voltage (V)	3.3\|5
Maximum Operating Supply Voltage (V)	3.6\|5.5
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	125
Temperature Flag	Opr
Supplier Temperature Grade	Automotive
Operating Supply Voltage (V)	3.3\|5
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-55

Supplier Package	MAP-BGA
Basic Package Type	Ball Grid Array
Pin Count	257
Lead Shape	Ball
PCB	257
Tab	N/R
Pin Pitch (mm)	0.8
Package Length (mm)	14
Package Width (mm)	14
Package Height (mm)	1.17(Max)
Package Diameter (mm)	N/R
Seated Plane Height (mm)	1.51(Max)
Mounting	Surface Mount
Package Weight (g)	0.4072
Package Material	Plastic
Package Description	Molded Array Process Ball Grid Array
Package Family Name	BGA
Package Outline	Link to Datasheet

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	40
Number of Reflow Cycle	3
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au
Under Plating Material	Ni
Terminal Base Material	N/A

Packaging	Tray
Quantity Of Packaging	152(Min)